Toshiba Highlights New Advances in Memory, SSD and Architecture Technologies at Flash Memory Summit

SANTA CLARA, Calif., Aug. 8, 2017 /PRNewswire/ — Toshiba America Electronic Components, Inc. (TAEC) will be on hand at the Flash Memory Summit (FMS) this week to showcase its latest memory and storage solutions. Having invented NAND flash 30 years ago, Toshiba continues to move the technology forward, as evidenced by recent announcements that further solidify the company’s leadership position: The introduction of 96-layer three-dimensional (3D) flash memory, QLC BiCS FLASHTM 3D flash memory and 3D flash memory with TSV technology were all industry firsts. At FMS, Toshiba will be demonstrating groundbreaking technologies in several different applications. Demonstrations will take place in Toshiba’s two-level booth (#407) on the show floor at the Santa Clara Convention Center from August 8-10.  Additionally, Toshiba will feature 10 presenters on various technologies and topics around SSDs and new flash technologies and applications.

Toshiba’s focus at FMS 2017 centers on how people’s lives are being upgraded by flash, which dovetails nicely with the FMS 2017 theme of creating the next generation of hardware and software solutions. According to Scott Nelson, senior vice president of TAEC’s memory business unit, “From self-driving cars to the cloud, virtual/augmented reality and so much more, flash memory continues to evolve in order to enable the solutions of tomorrow. Toshiba’s industry-leading, first-of-their-kind technologies are accelerating this evolution.”

Featured Keynote Presentation
“Flash Memory is Going Places We Have Never Been Before”
August 8, 12:10-12:40 p.m.

On Tuesday, August 8, from 12:10-12:40 p.m., Steve Fingerhut, senior…

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