SANTA CLARA, Calif., Sept. 12, 2017 (GLOBE NEWSWIRE) — Adesto Technologies (NASDAQ:IOTS), a leading provider of application-specific, ultra-low power non-volatile memory products, today announced that its EcoXiP™ product family, a new eXecute-in-Place (XiP) non-volatile memory (NVM) solution, complies with the specifications outlined in JEDEC’s new xSPI standard for non-volatile memory devices. This development opens new opportunities for EcoXiP, which is already being deployed across a wide range of application areas.
The xSPI standard establishes mechanical, electrical and transactional guidelines for developing high-throughput octal devices, such as the EcoXiP product, and provides users with assurance of controller compatibility with peripheral devices.
“Divergent products with different solutions to speed communication between the host controller and memory can confuse controller designers as to which direction to follow,” said Gideon Intrater, CTO at Adesto. ”This new standard will provide customers, including system developers and controller designers with assured compatibility. This milestone is key to faster and broader deployment of EcoXiP platform and provides the opportunity for new designs to move forward.”
A growing number of products targeting the internet of things such as Wi-Fi and LTE communications modules, wearables, point-of-sale controllers and other embedded devices need more program memory than what can be implemented economically on-chip using embedded Flash or SRAM. Together, projections for these devices total production in the hundreds of millions annually. Standalone DRAM devices are also not an attractive solution to be used as program memory in these applications due to standby power requirements and cost. Until now, to hit performance targets, system designers have been required to invest in memory solutions that are expensive, power-hungry and performance limiting.
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